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Corbin Church is a Project Manager in the Electronic Components division of Versentech, and has direct work experience in magnetic media (hard disk drives) and advanced semiconductor materials development. His expertise is focused on the quantitative analysis of new process scale-up as well as the investigation of emerging technologies for competitive advantage and commercial viability within targeted industries and supply chains.
Mr. Church worked previously for the Electronic Materials Division of BFGoodrich in Cleveland, Ohio as the Sr. Packaging Engineer. His responsibilities concentrated on application development and executing strategic initiatives to commercialize R&D projects. His knowledge spans many facets of microelectronics including IC manufacturing and packaging.
Previous to BFGoodrich, Mr. Church worked as a Process and Materials Engineer for the Ceramic Hard Disk Project at Raychem Corporation in Menlo Park, CA. His efforts there focused on developing a cost competitive manufacturing process to bring to market a next generation hard disk substrate to replace limiting, incumbent technologies. Mr. Church holds a Bachelor in Engineering (Chemical) from McGill University in Montreal, PQ. He is an engineer and a member of the Order of Engineers in Quebec (pending) and is also an affiliated member of IMAPS and IEEE.
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